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PCE
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CPC Subgroup
B31F 1/07

Embossing ( corrugating B31F1/20; embossing in combination with printing B41F19/02, B41M1/24; typewriters for embossing B41J3/38; stamping in combination with deforming B41K3/36)

Full Title

Mechanical deformation without removing material, e.g. in combination with laminating > Embossing ( corrugating B31F1/20; embossing in combination with printing B41F19/02, B41M1/24; typewriters for embossing B41J3/38; stamping in combination with deforming B41K3/36)

Top Applicants

Top 10 applicants by patent filingsfor class B31, 2013–2023, worldwide · Source: EPO PATSTAT

  1. GPI (GRAPHIC PACKAGING INTERNATIONAL) US 496
  2. P&G (PROCTER & GAMBLE COMPANY) US 403
  3. KIMBERLY-CLARK CORPORATION US 332
  4. RANPAK CORPORATION US 279
  5. PULPAC SE 256
  6. BOBST MEX CH 251
  7. TETRA LAVAL HOLDINGS & FINANCE CH 246
  8. PREGIS INNOVATIVE PACKAGING US 210
  9. WESTROCK SHARED SERVICES US 204
  10. BHS CORRUGATED MASCHINEN- UND ANLAGENBAU DE 198