CPC Subgroup Additional Only
B31F 2201/0761 Multi-layered
Full Title
Mechanical deformation of paper or cardboard without removing material > Embossing > Characteristics of the embossed product > Multi-layered
3 direct subcodes
Child Classifications
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- B31F 2201/0764 the layers being nested
- B31F 2201/0766 the layers being superposed tip to tip
- B31F 2201/0769 the layers being shifted
Top Applicants
Top 10 applicants by patent filingsfor class B31, 2013–2023, worldwide · Source: EPO PATSTAT
- GPI (GRAPHIC PACKAGING INTERNATIONAL) US 496
- P&G (PROCTER & GAMBLE COMPANY) US 403
- KIMBERLY-CLARK CORPORATION US 332
- RANPAK CORPORATION US 279
- PULPAC SE 256
- BOBST MEX CH 251
- TETRA LAVAL HOLDINGS & FINANCE CH 246
- PREGIS INNOVATIVE PACKAGING US 210
- WESTROCK SHARED SERVICES US 204
- BHS CORRUGATED MASCHINEN- UND ANLAGENBAU DE 198