CPC Subgroup Additional Only
B65D 2581/3441 3-D geometry or shape factors, e.g. depth-wise
Full Title
Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents > for packaging foodstuffs or other articles intended to be cooked or heated within > specially adapted to be heated by microwaves > Means for affecting the heating or cooking properties > Geometry or shape factors influencing the microwave heating properties > 3-D geometry or shape factors, e.g. depth-wise
Top Applicants
Top 10 applicants by patent filingsfor class B65, 2013–2023, worldwide · Source: EPO PATSTAT
- P&G (PROCTER & GAMBLE COMPANY) US 3,369
- KRONES DE 3,304
- TETRA LAVAL HOLDINGS & FINANCE CH 2,227
- CANON JP 2,051
- AUTOSTORE TECHNOLOGY NO 1,731
- GPI (GRAPHIC PACKAGING INTERNATIONAL) US 1,707
- CANON 1,693
- G.D IT 1,678
- MURATA MACHINERY JP 1,664
- DAIFUKU COMPANY JP 1,654