CPC Main Group Additional Only
B81C 2201/00 Manufacture or treatment of microstructural devices or systems
4 direct subcodes
Child Classifications
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- B81C 2201/01 in or on a substrate
- B81C 2201/03 Processes for manufacturing substrate-free structures
- B81C 2201/05 Temporary protection of devices or parts of the devices during manufacturing
- B81C 2201/11 Treatments for avoiding stiction of elastic or moving parts of MEMS
Top Applicants
Top 10 applicants by patent filingsfor class B81, 2013–2023, worldwide · Source: EPO PATSTAT
- ROBERT BOSCH DE 1,976
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 788
- INFINEON TECHNOLOGIES DE 759
- CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 555
- STMICROELECTRONICS IT 526
- INVENSENSE US 430
- MURATA MANUFACTURING COMPANY JP 418
- SEIKO EPSON CORPORATION 338
- CHINESE ACADEMY OF SCIENCES 338
- FRAUNHOFER DE 297