CPC Subgroup Additional Only
B81C 2201/03 Processes for manufacturing substrate-free structures
Full Title
Manufacture or treatment of microstructural devices or systems > Processes for manufacturing substrate-free structures
4 direct subcodes
Child Classifications
Navigate with arrow keys, Enter to open
- B81C 2201/032 LIGA process
- B81C 2201/034 Moulding
- B81C 2201/036 Hot embossing
- B81C 2201/038 Processes for manufacturing substrate-free structures not provided for in B81C2201/034 - B81C2201/036
Top Applicants
Top 10 applicants by patent filingsfor class B81, 2013–2023, worldwide · Source: EPO PATSTAT
- ROBERT BOSCH DE 1,976
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 788
- INFINEON TECHNOLOGIES DE 759
- CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 555
- STMICROELECTRONICS IT 526
- INVENSENSE US 430
- MURATA MANUFACTURING COMPANY JP 418
- SEIKO EPSON CORPORATION 338
- CHINESE ACADEMY OF SCIENCES 338
- FRAUNHOFER DE 297