Controlling internal stress of deposited layers

Full Title

Manufacture or treatment of microstructural devices or systems > in or on a substrate > Controlling physical properties of the material > Controlling internal stress of deposited layers

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• B81C 2201/0164 by doping the layer
• B81C 2201/0166 by ion implantation
• B81C 2201/0167 by adding further layers of materials having complementary strains, i.e. compressive or tensile strain
• B81C 2201/0169 by post-annealing
• B81C 2201/017 Methods for controlling internal stress of deposited layers not provided for in B81C2201/0164 - B81C2201/0169