Packaging MEMS

Full Title

Forming microstructural systems > Packaging MEMS

Child Classifications

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• B81C 2203/0109 Bonding an individual cap on the substrate
• B81C 2203/0118 Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
• B81C 2203/0127 Using a carrier for applying a plurality of packaging lids to the system wafer
• B81C 2203/0136 Growing or depositing of a covering layer
• B81C 2203/0145 Hermetically sealing an opening in the lid
• B81C 2203/0154 Moulding a cap over the MEMS device
• B81C 2203/0163 Reinforcing a cap, e.g. with ribs
• B81C 2203/0172 Seals