CPC Subgroup Additional Only
B81C 2203/03 Bonding two components
Full Title
Forming microstructural systems > Bonding two components
4 direct subcodes
Child Classifications
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- B81C 2203/031 Anodic bondings
- B81C 2203/032 Gluing
- B81C 2203/033 Thermal bonding
- B81C 2203/038 Bonding techniques not provided for in B81C2203/031 - B81C2203/037
Top Applicants
Top 10 applicants by patent filingsfor class B81, 2013–2023, worldwide · Source: EPO PATSTAT
- ROBERT BOSCH DE 1,976
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 788
- INFINEON TECHNOLOGIES DE 759
- CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 555
- STMICROELECTRONICS IT 526
- INVENSENSE US 430
- MURATA MANUFACTURING COMPANY JP 418
- SEIKO EPSON CORPORATION 338
- CHINESE ACADEMY OF SCIENCES 338
- FRAUNHOFER DE 297