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CPC Subgroup Additional Only
B81C 2203/052

Passive alignment, i.e. using only structural arrangements or thermodynamic forces without an internal or external apparatus

Full Title

Forming microstructural systems > Aligning components to be assembled > Passive alignment, i.e. using only structural arrangements or thermodynamic forces without an internal or external apparatus

3 direct subcodes

Child Classifications

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  • B81C 2203/054 using structural alignment aids, e.g. spacers, interposers, male/female parts, rods or balls
  • B81C 2203/055 using the surface tension of fluid solder to align the elements
  • B81C 2203/057 Passive alignment techniques not provided for in B81C2203/054 - B81C2203/055

Top Applicants

Top 10 applicants by patent filingsfor class B81, 2013–2023, worldwide · Source: EPO PATSTAT

  1. ROBERT BOSCH DE 1,976
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 788
  3. INFINEON TECHNOLOGIES DE 759
  4. CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 555
  5. STMICROELECTRONICS IT 526
  6. INVENSENSE US 430
  7. MURATA MANUFACTURING COMPANY JP 418
  8. SEIKO EPSON CORPORATION 338
  9. CHINESE ACADEMY OF SCIENCES 338
  10. FRAUNHOFER DE 297