CPC Subgroup Additional Only
B81C 2203/052 Passive alignment, i.e. using only structural arrangements or thermodynamic forces without an internal or external apparatus
Full Title
Forming microstructural systems > Aligning components to be assembled > Passive alignment, i.e. using only structural arrangements or thermodynamic forces without an internal or external apparatus
3 direct subcodes
Child Classifications
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- B81C 2203/054 using structural alignment aids, e.g. spacers, interposers, male/female parts, rods or balls
- B81C 2203/055 using the surface tension of fluid solder to align the elements
- B81C 2203/057 Passive alignment techniques not provided for in B81C2203/054 - B81C2203/055
Top Applicants
Top 10 applicants by patent filingsfor class B81, 2013–2023, worldwide · Source: EPO PATSTAT
- ROBERT BOSCH DE 1,976
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 788
- INFINEON TECHNOLOGIES DE 759
- CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 555
- STMICROELECTRONICS IT 526
- INVENSENSE US 430
- MURATA MANUFACTURING COMPANY JP 418
- SEIKO EPSON CORPORATION 338
- CHINESE ACADEMY OF SCIENCES 338
- FRAUNHOFER DE 297