CPC Subgroup Additional Only
B81C 2203/05 Aligning components to be assembled
Full Title
Forming microstructural systems > Aligning components to be assembled
3 direct subcodes
Child Classifications
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- B81C 2203/051 Active alignment, e.g. using internal or external actuators, magnets, sensors, marks or marks detectors
- B81C 2203/052 Passive alignment, i.e. using only structural arrangements or thermodynamic forces without an internal or external apparatus
- B81C 2203/058 Aligning components using methods not provided for in B81C2203/051 - B81C2203/052
Top Applicants
Top 10 applicants by patent filingsfor class B81, 2013–2023, worldwide · Source: EPO PATSTAT
- ROBERT BOSCH DE 1,976
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 788
- INFINEON TECHNOLOGIES DE 759
- CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 555
- STMICROELECTRONICS IT 526
- INVENSENSE US 430
- MURATA MANUFACTURING COMPANY JP 418
- SEIKO EPSON CORPORATION 338
- CHINESE ACADEMY OF SCIENCES 338
- FRAUNHOFER DE 297