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CPC Class Not Allocatable
C23

COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL

Description

C23 encompasses processes and methods for modifying metal surfaces through coating, chemical treatment, and vapor deposition techniques. The class covers application of metallic or non-metallic coatings to metal substrates, chemical surface treatments (including passivation and conversion coatings), diffusion treatments altering surface composition, and vacuum-based deposition methods such as evaporation, sputtering, ion implantation, and chemical vapor deposition. It also includes technologies for preventing corrosion, oxidation, and incrustation of metallic materials. Related surface engineering processes such as electroplating and case hardening are typically classified in other sections of metallurgy or organic chemistry.

Filing statistics

CPC C23 recorded 311,167 patent applications worldwide between 2013 and 2023, summed across its 4 subclasses. Annual filings grew from 21,791 in 2013 to 26,911 in 2023 (+23%), peaking at 32,789 applications in 2018. The most active applicants in class C23 are APPLIED MATERIALS (10,596 applications), TOKYO ELECTRON (5,229 applications) and LAM RESEARCH CORPORATION (3,622 applications).

Source: EPO PATSTAT, worldwide filings

4 direct subcodes

Child Classifications

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Top Applicants

Top 10 applicants by patent filings, 2013–2023, worldwide · Source: EPO PATSTAT

  1. APPLIED MATERIALS US 10,596
  2. TOKYO ELECTRON JP 5,229
  3. LAM RESEARCH CORPORATION US 3,622
  4. NIPPON STEEL CORPORATION JP 3,171
  5. JFE STEEL JP 3,128
  6. ASM IP HOLDING NL 2,722
  7. ARCELORMITTAL LU 2,481
  8. TOKYO ELECTRON 2,359
  9. APPLIED MATERIALS 2,284
  10. CHINESE ACADEMY OF SCIENCES 2,110