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PCE
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CPC Subgroup
C23C 10/34

Embedding in a powder mixture, i.e. pack cementation

Full Title

Solid state diffusion of only metal elements or silicon into metallic material surfaces > using solids, e.g. powders, pastes > Embedding in a powder mixture, i.e. pack cementation

3 direct subcodes

Child Classifications

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  • C23C 10/58 more than one element being diffused in more than one step

Top Applicants

Top 10 applicants by patent filingsfor class C23, 2013–2023, worldwide · Source: EPO PATSTAT

  1. APPLIED MATERIALS US 10,596
  2. TOKYO ELECTRON JP 5,229
  3. LAM RESEARCH CORPORATION US 3,622
  4. NIPPON STEEL CORPORATION JP 3,171
  5. JFE STEEL JP 3,128
  6. ASM IP HOLDING NL 2,722
  7. ARCELORMITTAL LU 2,481
  8. TOKYO ELECTRON 2,359
  9. APPLIED MATERIALS 2,284
  10. CHINESE ACADEMY OF SCIENCES 2,110