CPC Subgroup
C23C 2/51 Full Title
Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
Top Applicants
Top 10 applicants by patent filingsfor class C23, 2013–2023, worldwide · Source: EPO PATSTAT
- APPLIED MATERIALS US 10,596
- TOKYO ELECTRON JP 5,229
- LAM RESEARCH CORPORATION US 3,622
- NIPPON STEEL CORPORATION JP 3,171
- JFE STEEL JP 3,128
- ASM IP HOLDING NL 2,722
- ARCELORMITTAL LU 2,481
- TOKYO ELECTRON 2,359
- APPLIED MATERIALS 2,284
- CHINESE ACADEMY OF SCIENCES 2,110