CPC Main Group
C23F 1/00 Etching metallic material by chemical means (manufacture of printing surfaces B41C; manufacture of printed circuits H05K)
6 direct subcodes
Child Classifications
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- C23F 1/02 Local etching
- C23F 1/06 Sharpening files
- C23F 1/08 Apparatus, e.g. for photomechanical printing surfaces (photo- mechanical reproduction G03F)
- C23F 1/10 Etching compositions (C23F1/44 takes precedence)
- C23F 1/44 Compositions for etching metallic material from a metallic material substrate of different composition
- C23F 1/46 Regeneration of etching compositions
Top Applicants
Top 10 applicants by patent filingsfor class C23, 2013–2023, worldwide · Source: EPO PATSTAT
- APPLIED MATERIALS US 10,596
- TOKYO ELECTRON JP 5,229
- LAM RESEARCH CORPORATION US 3,622
- NIPPON STEEL CORPORATION JP 3,171
- JFE STEEL JP 3,128
- ASM IP HOLDING NL 2,722
- ARCELORMITTAL LU 2,481
- TOKYO ELECTRON 2,359
- APPLIED MATERIALS 2,284
- CHINESE ACADEMY OF SCIENCES 2,110