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CPC Subgroup
C23G 3/02

for cleaning wires, strips, filaments continuously

Full Title

Apparatus for cleaning or pickling metallic material (with organic solvents C23G5/04) > for cleaning wires, strips, filaments continuously

Filing statistics

CPC C23G 3/02 belongs to the parent subclass C23G, which recorded 17,129 patent applications worldwide between 2013 and 2023. Annual filings grew from 614 in 2013 to 1,507 in 2023 (+145%), peaking at 2,170 applications in 2020. The most active applicants in class C23 are APPLIED MATERIALS (10,596 applications), TOKYO ELECTRON (5,229 applications) and LAM RESEARCH CORPORATION (3,622 applications).

Source: EPO PATSTAT, worldwide filings

5 direct subcodes

Child Classifications

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Top Applicants

Top 10 applicants by patent filingsfor class C23, 2013–2023, worldwide · Source: EPO PATSTAT

  1. APPLIED MATERIALS US 10,596
  2. TOKYO ELECTRON JP 5,229
  3. LAM RESEARCH CORPORATION US 3,622
  4. NIPPON STEEL CORPORATION JP 3,171
  5. JFE STEEL JP 3,128
  6. ASM IP HOLDING NL 2,722
  7. ARCELORMITTAL LU 2,481
  8. TOKYO ELECTRON 2,359
  9. APPLIED MATERIALS 2,284
  10. CHINESE ACADEMY OF SCIENCES 2,110