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CPC Subclass Not Allocatable
C25D

PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR

Description

C25D covers electroplating, electroless plating, and electrophoretic deposition processes used to apply protective or decorative metallic and non-metallic coatings onto substrates. It also encompasses electroforming techniques for creating metal parts by electrodeposition and electrolytic joining methods for assembling workpieces. This subclass includes apparatus designs, process parameters, and electrolyte formulations specific to these coating and forming operations, distinguishing it from general electrochemical processes (C25A) and electrorefining or electrowinning operations (C25C).

Filing statistics

CPC subclass C25D recorded 66,035 patent applications worldwide between 2013 and 2023. Annual filings grew from 4,313 in 2013 to 5,873 in 2023 (+36%), peaking at 7,202 applications in 2018. The most active applicants in class C25 are CHINESE ACADEMY OF SCIENCES (1,393 applications), JFE STEEL (914 applications) and EBARA CORPORATION (738 applications).

Source: EPO PATSTAT, worldwide filings

10 direct subcodes

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Top Applicants

Top 10 applicants by patent filingsfor class C25, 2013–2023, worldwide · Source: EPO PATSTAT

  1. CHINESE ACADEMY OF SCIENCES 1,393
  2. JFE STEEL JP 914
  3. EBARA CORPORATION JP 738
  4. INDUSTRIE DE NORA IT 674
  5. JX NIPPON MINING & METALS CORPORATION JP 652
  6. NIPPON STEEL CORPORATION JP 633
  7. CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 630
  8. ROBERT BOSCH DE 626
  9. SIEMENS DE 587
  10. ATOTECH DEUTSCHLAND DE 561