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CPC Subclass Not Allocatable
C25D

PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR

Description

C25D covers electroplating, electroless plating, and electrophoretic deposition processes used to apply protective or decorative metallic and non-metallic coatings onto substrates. It also encompasses electroforming techniques for creating metal parts by electrodeposition and electrolytic joining methods for assembling workpieces. This subclass includes apparatus designs, process parameters, and electrolyte formulations specific to these coating and forming operations, distinguishing it from general electrochemical processes (C25A) and electrorefining or electrowinning operations (C25C).

10 direct subcodes

Child Classifications

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Top Applicants

Top 10 applicants by patent filingsfor class C25, 2013–2023, worldwide · Source: EPO PATSTAT

  1. CHINESE ACADEMY OF SCIENCES 1,393
  2. JFE STEEL JP 914
  3. EBARA CORPORATION JP 738
  4. INDUSTRIE DE NORA IT 674
  5. JX NIPPON MINING & METALS CORPORATION JP 652
  6. NIPPON STEEL CORPORATION JP 633
  7. CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 630
  8. ROBERT BOSCH DE 626
  9. SIEMENS DE 587
  10. ATOTECH DEUTSCHLAND DE 561