CPC Subgroup
D21H 27/42 comprising dry-laid paper
Full Title
Special paper not otherwise provided for, e.g. made by multi-step processes > Multi-ply (for surface covering D21H27/18; making on paper-making machines D21F9/00, D21F11/00) > comprising dry-laid paper
Top Applicants
Top 10 applicants by patent filingsfor class D21, 2013–2023, worldwide · Source: EPO PATSTAT
- VOITH PATENT DE 1,857
- STORA ENSO FI 1,552
- KEMIRA FI 1,173
- KIMBERLY-CLARK CORPORATION US 1,107
- VALMET TECHNOLOGIES FI 965
- VALMET SE 943
- P&G (PROCTER & GAMBLE COMPANY) US 941
- OMYA INTERNATIONAL CH 821
- UPM-KYMMENE CORPORATION FI 512
- SEIKO EPSON CORPORATION JP 501