CPC Subgroup Additional Only
F05D 2260/20 Heat transfer, e.g. cooling
Full Title
Function > Heat transfer, e.g. cooling
16 direct subcodes
Child Classifications
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- F05D 2260/201 by impingement of a fluid
- F05D 2260/202 by film cooling
- F05D 2260/203 by transpiration cooling
- F05D 2260/204 by the use of microcircuits
- F05D 2260/205 Cooling fluid recirculation, i.e. after cooling one or more components is the cooling fluid recovered and used elsewhere for other purposes
- F05D 2260/207 using a phase changing mass, e.g. heat absorbing by melting or boiling
- F05D 2260/208 using heat pipes
- F05D 2260/209 using vortex tubes
- F05D 2260/211 by intercooling, e.g. during a compression cycle
- F05D 2260/212 by water injection
- F05D 2260/213 by the provision of a heat exchanger within the cooling circuit
- F05D 2260/221 Improvement of heat transfer
- F05D 2260/231 Preventing heat transfer
- F05D 2260/232 characterized by the cooling medium
- F05D 2260/234 of the generator by compressor inlet air
- F05D 2260/24 for draft enhancement in chimneys, using solar or other heat sources
Top Applicants
Top 10 applicants by patent filingsfor class F05, 2013–2023, worldwide · Source: EPO PATSTAT
- GE (GENERAL ELECTRIC COMPANY) US 12,002
- UNITED TECHNOLOGIES CORPORATION (UTC) US 8,736
- SAFRAN AIRCRAFT ENGINES FR 6,804
- RAYTHEON TECHNOLOGIES CORPORATION US 4,530
- SIEMENS DE 4,371
- GE (GENERAL ELECTRIC COMPANY) 3,686
- ROLLS-ROYCE GB 3,594
- PRATT & WHITNEY CANADA CORPORATION CA 3,415
- VESTAS DK 3,076
- WOBBEN PROPERTIES DE 2,614