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CPC Main Group Additional Only
G01B 2210/00

Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors

11 direct subcodes

Child Classifications

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  • G01B 2210/50 Using chromatic effects to achieve wavelength-dependent depth resolution
  • G01B 2210/52 Combining or merging partially overlapping images to an overall image
  • G01B 2210/54 Revolving an optical measuring instrument around a body
  • G01B 2210/56 Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
  • G01B 2210/58 Wireless transmission of information between a sensor or probe and a control or evaluation unit
  • G01B 2210/60 Unique sensor identification
  • G01B 2210/62 Support for workpiece air film or bearing with positive or negative pressure
  • G01B 2210/64 Interconnection or interfacing through or under capping or via rear of substrate in microsensors
  • G01B 2210/66 Rock or ground anchors having deformation measuring means

Top Applicants

Top 10 applicants by patent filingsfor class G01, 2013–2023, worldwide · Source: EPO PATSTAT

  1. CHINESE ACADEMY OF SCIENCES 21,460
  2. ROBERT BOSCH DE 17,801
  3. SGCC(STATE GRID CORPORATION OF CHINA) 17,347
  4. SAMSUNG ELECTRONICS COMPANY KR 13,192
  5. QUALCOMM US 9,900
  6. HALLIBURTON ENERGY SERVICES GROUP US 9,742
  7. PHILIPS ELECTRONICS NL 7,249
  8. MITSUBISHI ELECTRIC CORPORATION JP 6,503
  9. ZHEJIANG UNIVERSITY 6,414
  10. DENSO CORPORATION JP 6,382