CPC Main Group Additional Only
G01B 2210/00 Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
11 direct subcodes
Child Classifications
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- G01B 2210/10 Wheel alignment
- G01B 2210/40 Caliper-like sensors
- G01B 2210/50 Using chromatic effects to achieve wavelength-dependent depth resolution
- G01B 2210/52 Combining or merging partially overlapping images to an overall image
- G01B 2210/54 Revolving an optical measuring instrument around a body
- G01B 2210/56 Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
- G01B 2210/58 Wireless transmission of information between a sensor or probe and a control or evaluation unit
- G01B 2210/60 Unique sensor identification
- G01B 2210/62 Support for workpiece air film or bearing with positive or negative pressure
- G01B 2210/64 Interconnection or interfacing through or under capping or via rear of substrate in microsensors
- G01B 2210/66 Rock or ground anchors having deformation measuring means
Top Applicants
Top 10 applicants by patent filingsfor class G01, 2013–2023, worldwide · Source: EPO PATSTAT
- CHINESE ACADEMY OF SCIENCES 21,460
- ROBERT BOSCH DE 17,801
- SGCC(STATE GRID CORPORATION OF CHINA) 17,347
- SAMSUNG ELECTRONICS COMPANY KR 13,192
- QUALCOMM US 9,900
- HALLIBURTON ENERGY SERVICES GROUP US 9,742
- PHILIPS ELECTRONICS NL 7,249
- MITSUBISHI ELECTRIC CORPORATION JP 6,503
- ZHEJIANG UNIVERSITY 6,414
- DENSO CORPORATION JP 6,382