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CPC Subgroup
G01K 5/58

the solid body being constrained at more than one point, e.g. rod, plate, diaphragm (G01K5/62 takes precedence)

Full Title

Measuring temperature based on the expansion or contraction of a material (G01K9/00 takes precedence; giving other than momentary value of temperature G01K3/00) > the material being a solid > constrained so that expansion or contraction causes a deformation of the solid > the solid body being constrained at more than one point, e.g. rod, plate, diaphragm (G01K5/62 takes precedence)

1 direct subcode

Child Classifications

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  • G01K 5/60 the body being a flexible wire or ribbon

Top Applicants

Top 10 applicants by patent filingsfor class G01, 2013–2023, worldwide · Source: EPO PATSTAT

  1. CHINESE ACADEMY OF SCIENCES 21,460
  2. ROBERT BOSCH DE 17,801
  3. SGCC(STATE GRID CORPORATION OF CHINA) 17,347
  4. SAMSUNG ELECTRONICS COMPANY KR 13,192
  5. QUALCOMM US 9,900
  6. HALLIBURTON ENERGY SERVICES GROUP US 9,742
  7. PHILIPS ELECTRONICS NL 7,249
  8. MITSUBISHI ELECTRIC CORPORATION JP 6,503
  9. ZHEJIANG UNIVERSITY 6,414
  10. DENSO CORPORATION JP 6,382