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DIFF Subgroup
G01K 5/58

the solid body being constrained at more than one point, e.g. rod, plate, diaphragm (G01K5/62 takes precedence)

Introduced: September 1968

Title

Titles differ between systems:

IPC: the solid body being constrained at more than one point, e.g. rod, plate, diaphragm

CPC: the solid body being constrained at more than one point, e.g. rod, plate, diaphragm (G01K5/62 takes precedence)

Full Title

Full titles differ between systems:

IPC:

Measuring temperature based on the expansion or contraction of a material > the material being a solid > constrained so that expansion or contraction causes a deformation of the solid > the solid body being constrained at more than one point, e.g. rod, plate, diaphragm

CPC:

Measuring temperature based on the expansion or contraction of a material (G01K9/00 takes precedence; giving other than momentary value of temperature G01K3/00) > the material being a solid > constrained so that expansion or contraction causes a deformation of the solid > the solid body being constrained at more than one point, e.g. rod, plate, diaphragm (G01K5/62 takes precedence)

IPC and CPC are identically structured here. All 1 subcodes exist in both systems.

Child Classifications

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  • G01K 5/60 the body being a flexible wire or ribbon IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class G01,2013–2023, worldwide · Source: EPO PATSTAT

  1. SGCC(STATE GRID CORPORATION OF CHINA) 41,447
  2. CHINESE ACADEMY OF SCIENCES 32,952
  3. ROBERT BOSCH DE 16,470
  4. SAMSUNG ELECTRONICS COMPANY KR 10,052
  5. SINOPEC (CHINA PETROCHEMICAL CORPORATION) 9,573
  6. ZHEJIANG UNIVERSITY 9,529
  7. GUANGDONG POWER GRID CORPORATION 8,615
  8. TSINGHUA UNIVERSITY 7,805
  9. HALLIBURTON ENERGY SERVICES GROUP US 7,796
  10. QUALCOMM US 7,171

Top Applicants (CPC)

Class G01,2013–2023, worldwide · Source: EPO PATSTAT

  1. CHINESE ACADEMY OF SCIENCES 21,460
  2. ROBERT BOSCH DE 17,801
  3. SGCC(STATE GRID CORPORATION OF CHINA) 17,347
  4. SAMSUNG ELECTRONICS COMPANY KR 13,192
  5. QUALCOMM US 9,900
  6. HALLIBURTON ENERGY SERVICES GROUP US 9,742
  7. PHILIPS ELECTRONICS NL 7,249
  8. MITSUBISHI ELECTRIC CORPORATION JP 6,503
  9. ZHEJIANG UNIVERSITY 6,414
  10. DENSO CORPORATION JP 6,382