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CPC Main Group Additional Only
G06F 2111/00

Details relating to CAD techniques

Filing statistics

CPC G06F 2111/00 belongs to the parent subclass G06F, which recorded 2,867,653 patent applications worldwide between 2013 and 2023. Annual filings grew from 154,451 in 2013 to 335,605 in 2023 (+117%), peaking at 367,101 applications in 2021. The most active applicants in class G06 are SAMSUNG ELECTRONICS COMPANY (76,952 applications), IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) (62,841 applications) and MICROSOFT TECHNOLOGY LICENSING (44,778 applications).

Source: EPO PATSTAT, worldwide filings

10 direct subcodes

Child Classifications

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  • G06F 2111/02 CAD in a network environment, e.g. collaborative CAD or distributed simulation
  • G06F 2111/04 Constraint-based CAD
  • G06F 2111/06 Multi-objective optimisation, e.g. Pareto optimisation using simulated annealing [SA], ant colony algorithms or genetic algorithms [GA]
  • G06F 2111/08 Probabilistic or stochastic CAD
  • G06F 2111/10 Numerical modelling
  • G06F 2111/12 Symbolic schematics
  • G06F 2111/14 related to nanotechnology
  • G06F 2111/16 Customisation or personalisation
  • G06F 2111/18 using virtual or augmented reality
  • G06F 2111/20 Configuration CAD, e.g. designing by assembling or positioning modules selected from libraries of predesigned modules

Top Applicants

Top 10 applicants by patent filingsfor class G06, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 76,952
  2. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 62,841
  3. MICROSOFT TECHNOLOGY LICENSING US 44,778
  4. GOOGLE US 35,735
  5. INTEL CORPORATION US 32,087
  6. HUAWEI TECHNOLOGIES COMPANY CN 30,572
  7. TENCENT TECHNOLOGY (SHENZHEN) COMPANY 25,023
  8. APPLE US 23,482
  9. SGCC(STATE GRID CORPORATION OF CHINA) 22,548
  10. HUAWEI TECHNOLOGIES COMPANY 20,917