CPC Main Group Additional Only
G06F 2113/00 Details relating to the application field
14 direct subcodes
Child Classifications
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- G06F 2113/02 Data centres
- G06F 2113/04 Power grid distribution networks
- G06F 2113/06 Wind turbines or wind farms
- G06F 2113/08 Fluids
- G06F 2113/10 Additive manufacturing, e.g. three-dimensional [3D] printing
- G06F 2113/12 Cloth
- G06F 2113/14 Pipes
- G06F 2113/16 Cables, cable trees or wire harnesses
- G06F 2113/18 Chip packaging
- G06F 2113/20 Packaging, e.g. boxes or containers
- G06F 2113/22 Moulding
- G06F 2113/24 Sheet material
- G06F 2113/26 Composites
- G06F 2113/28 Fuselage, exterior or interior
Top Applicants
Top 10 applicants by patent filingsfor class G06, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 76,952
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 62,841
- MICROSOFT TECHNOLOGY LICENSING US 44,778
- GOOGLE US 35,735
- INTEL CORPORATION US 32,087
- HUAWEI TECHNOLOGIES COMPANY CN 30,572
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY 25,023
- APPLE US 23,482
- SGCC(STATE GRID CORPORATION OF CHINA) 22,548
- HUAWEI TECHNOLOGIES COMPANY 20,917