CPC Subgroup Additional Only
G06F 2203/04111 Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
Full Title
Indexing scheme relating to G06F3/00 - G06F3/048 > Indexing scheme relating to G06F3/041 - G06F3/045 > Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
Top Applicants
Top 10 applicants by patent filingsfor class G06, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 76,952
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 62,841
- MICROSOFT TECHNOLOGY LICENSING US 44,778
- GOOGLE US 35,735
- INTEL CORPORATION US 32,087
- HUAWEI TECHNOLOGIES COMPANY CN 30,572
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY 25,023
- APPLE US 23,482
- SGCC(STATE GRID CORPORATION OF CHINA) 22,548
- HUAWEI TECHNOLOGIES COMPANY 20,917