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CPC Main Group
H01B 17/00

Insulators or insulating bodies characterised by their form

Filing statistics

CPC H01B 17/00 belongs to the parent subclass H01B, which recorded 140,018 patent applications worldwide between 2013 and 2023. Annual filings grew from 10,354 in 2013 to 11,276 in 2023 (+9%), peaking at 15,902 applications in 2016. The most active applicants in class H01 are SAMSUNG ELECTRONICS COMPANY (37,897 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (36,116 applications) and APPLIED MATERIALS (21,640 applications).

Source: EPO PATSTAT, worldwide filings

15 direct subcodes

Child Classifications

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  • H01B 17/24 Insulators apertured for fixing by nail, screw, wire, or bar, e.g. diabolo, bobbin
  • H01B 17/34 Insulators containing liquid, e.g. oil
  • H01B 17/36 Insulators having evacuated or gas-filled spaces
  • H01B 17/50 with surfaces specially treated for preserving insulating properties, e.g. for protection against moisture, dirt, or the like
  • H01B 17/54 having heating or cooling devices

Top Applicants

Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 37,897
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
  3. APPLIED MATERIALS US 21,640
  4. LG ENERGY SOLUTION KR 20,770
  5. LG CHEM KR 19,835
  6. TOKYO ELECTRON JP 18,519
  7. ROBERT BOSCH DE 14,595
  8. INTEL CORPORATION US 13,580
  9. MURATA MANUFACTURING COMPANY JP 12,151
  10. SAMSUNG SDI COMPANY KR 12,080