CPC Subgroup
H01B 17/56 Insulating bodies
Full Title
Insulators or insulating bodies characterised by their form > Insulating bodies
5 direct subcodes
Child Classifications
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- H01B 17/58 Tubes, sleeves, beads, or bobbins through which the conductor passes
- H01B 17/60 Composite insulating bodies
- H01B 17/62 Insulating-layers or insulating-films on metal bodies
- H01B 17/64 with conductive admixtures, inserts or layers
- H01B 17/66 Joining insulating bodies together, e.g. by bonding
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080