CPC Subgroup
H01C 1/024 the housing or enclosure being hermetically sealed (H01C1/028, H01C1/032, H01C1/034 take precedence)
Full Title
Details > Housing; Enclosing; Embedding; Filling the housing or enclosure > the housing or enclosure being hermetically sealed (H01C1/028, H01C1/032, H01C1/034 take precedence)
1 direct subcode
Child Classifications
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- H01C 1/026 with gaseous or vacuum spacing between the resistive element and the housing or casing
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080