the housing or enclosure being hermetically sealed (H01C1/028, H01C1/032, H01C1/034 take precedence)

Introduced: July 1974

Title

Titles differ between systems:

IPC: the housing or enclosure being hermetically sealed

CPC: the housing or enclosure being hermetically sealed (H01C1/028, H01C1/032, H01C1/034 take precedence)

Full Title

Full titles differ between systems:

IPC:

Details > Housing; Enclosing; Embedding; Filling the housing or enclosure > the housing or enclosure being hermetically sealed

CPC:

Details > Housing; Enclosing; Embedding; Filling the housing or enclosure > the housing or enclosure being hermetically sealed (H01C1/028, H01C1/032, H01C1/034 take precedence)

IPC and CPC are identically structured here. All 1 subcodes exist in both systems.

IPC defines codes here since 1974.

Child Classifications

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H01C 1/026 with gaseous or vacuum spacing between the resistive element and the housing or casing since 1974 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
SAMSUNG ELECTRONICS COMPANY KR 42,206
LG CHEM KR 21,383
APPLIED MATERIALS US 20,441
LG ENERGY SOLUTION KR 20,279
SAMSUNG DISPLAY KR 19,725
CHINESE ACADEMY OF SCIENCES 19,400
TOYOTA MOTOR CORPORATION 18,819
SGCC(STATE GRID CORPORATION OF CHINA) 18,082
TOKYO ELECTRON JP 17,634

Top Applicants (CPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

SAMSUNG ELECTRONICS COMPANY KR 37,897
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
APPLIED MATERIALS US 21,640
LG ENERGY SOLUTION KR 20,770
LG CHEM KR 19,835
TOKYO ELECTRON JP 18,519
ROBERT BOSCH DE 14,595
INTEL CORPORATION US 13,580
MURATA MANUFACTURING COMPANY JP 12,151
SAMSUNG SDI COMPANY KR 12,080