CPC Main Group
H01G 2/00 Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
8 direct subcodes
Child Classifications
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- H01G 2/02 Mountings
- H01G 2/08 Cooling arrangements; Heating arrangements; Ventilating arrangements
- H01G 2/10 Housing; Encapsulation
- H01G 2/12 Protection against corrosion (H01G2/10 takes precedence)
- H01G 2/14 Protection against electric or thermal overload (by cooling H01G2/08)
- H01G 2/20 Arrangements for preventing discharge from edges of electrodes
- H01G 2/22 Electrostatic or magnetic shielding
- H01G 2/24 Distinguishing marks, e.g. colour coding
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080