CPC Main Group
H01G 2/00 Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
Filing statistics
CPC H01G 2/00 belongs to the parent subclass H01G, which recorded 84,475 patent applications worldwide between 2013 and 2023. Annual filings grew from 6,481 in 2013 to 7,606 in 2023 (+17%), peaking at 8,803 applications in 2018. The most active applicants in class H01 are SAMSUNG ELECTRONICS COMPANY (37,897 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (36,116 applications) and APPLIED MATERIALS (21,640 applications).
Source: EPO PATSTAT, worldwide filings
8 direct subcodes
Child Classifications
Navigate with arrow keys, Enter to open
- H01G 2/02 Mountings
- H01G 2/08 Cooling arrangements; Heating arrangements; Ventilating arrangements
- H01G 2/10 Housing; Encapsulation
- H01G 2/12 Protection against corrosion (H01G2/10 takes precedence)
- H01G 2/14 Protection against electric or thermal overload (by cooling H01G2/08)
- H01G 2/20 Arrangements for preventing discharge from edges of electrodes
- H01G 2/22 Electrostatic or magnetic shielding
- H01G 2/24 Distinguishing marks, e.g. colour coding
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080