Fixed capacitors; Processes of their manufacture (electrolytic capacitors H01G9/00)

Filing statistics

CPC H01G 4/00 belongs to the parent subclass H01G, which recorded 84,475 patent applications worldwide between 2013 and 2023. Annual filings grew from 6,481 in 2013 to 7,606 in 2023 (+17%), peaking at 8,803 applications in 2018. The most active applicants in class H01 are SAMSUNG ELECTRONICS COMPANY (37,897 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (36,116 applications) and APPLIED MATERIALS (21,640 applications).

Source: EPO PATSTAT, worldwide filings

9 direct subcodes

Child Classifications

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H01G 4/002 Details
H01G 4/26 Folded capacitors
H01G 4/28 Tubular capacitors
H01G 4/30 Stacked capacitors (H01G4/33 takes precedence)
H01G 4/32 Wound capacitors
H01G 4/33 Thin- or thick-film capacitors
H01G 4/35 Feed-through capacitors or anti-noise capacitors
H01G 4/38 Multiple capacitors, i.e. structural combinations of fixed capacitors
H01G 4/40 Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations

Top Applicants

Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT

SAMSUNG ELECTRONICS COMPANY KR 37,897
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
APPLIED MATERIALS US 21,640
LG ENERGY SOLUTION KR 20,770
LG CHEM KR 19,835
TOKYO ELECTRON JP 18,519
ROBERT BOSCH DE 14,595
INTEL CORPORATION US 13,580
MURATA MANUFACTURING COMPANY JP 12,151
SAMSUNG SDI COMPANY KR 12,080