CPC Subgroup
H01G 4/228 Terminals
Full Title
Fixed capacitors; Processes of their manufacture (electrolytic capacitors H01G9/00) > Details > Terminals
5 direct subcodes
Child Classifications
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- H01G 4/232 electrically connecting two or more layers of a stacked or rolled capacitor
- H01G 4/236 leading through the housing, i.e. lead-through
- H01G 4/242 the capacitive element surrounding the terminal
- H01G 4/248 the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence)
- H01G 4/252 the terminals being coated on the capacitive element (H01G4/232 takes precedence)
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080