Connections

Filing statistics

CPC H01H 2207/00 belongs to the parent subclass H01H, which recorded 117,356 patent applications worldwide between 2013 and 2023. Annual filings grew from 8,912 in 2013 to 9,173 in 2023 (+3%), peaking at 12,388 applications in 2020. The most active applicants in class H01 are SAMSUNG ELECTRONICS COMPANY (37,897 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (36,116 applications) and APPLIED MATERIALS (21,640 applications).

Source: EPO PATSTAT, worldwide filings

18 direct subcodes

Child Classifications

Navigate with arrow keys, Enter to open

H01H 2207/002 Conductive rubber; Zebra
H01H 2207/004 Printed circuit tail
H01H 2207/006 Upraised portions
H01H 2207/008 Adhesive means; Conductive adhesive
H01H 2207/01 from bottom to top layer
H01H 2207/012 via underside of substrate
H01H 2207/016 Jumpers; Cross-overs
H01H 2207/02 Solder
H01H 2207/022 Plug
H01H 2207/026 Pressure contact
H01H 2207/028 on spacer
H01H 2207/03 via return spring
H01H 2207/032 Surface mounted component
H01H 2207/034 sealed
H01H 2207/036 Crimping connector
H01H 2207/038 Conductive paste
H01H 2207/04 Details of printed conductors
H01H 2207/048 Inductive or infrared coupling

Top Applicants

Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT

SAMSUNG ELECTRONICS COMPANY KR 37,897
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
APPLIED MATERIALS US 21,640
LG ENERGY SOLUTION KR 20,770
LG CHEM KR 19,835
TOKYO ELECTRON JP 18,519
ROBERT BOSCH DE 14,595
INTEL CORPORATION US 13,580
MURATA MANUFACTURING COMPANY JP 12,151
SAMSUNG SDI COMPANY KR 12,080