Layers

Filing statistics

CPC H01H 2209/00 belongs to the parent subclass H01H, which recorded 117,356 patent applications worldwide between 2013 and 2023. Annual filings grew from 8,912 in 2013 to 9,173 in 2023 (+3%), peaking at 12,388 applications in 2020. The most active applicants in class H01 are SAMSUNG ELECTRONICS COMPANY (37,897 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (36,116 applications) and APPLIED MATERIALS (21,640 applications).

Source: EPO PATSTAT, worldwide filings

13 direct subcodes

Child Classifications

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H01H 2209/002 Materials
H01H 2209/004 Depressions or protrusions on switch sites
H01H 2209/006 Force isolators
H01H 2209/01 Increasing rigidity; Anti-creep
H01H 2209/012 avoiding too large deformation or stress
H01H 2209/014 composed of different layers; Lubricant in between
H01H 2209/016 Protection layer, e.g. for legend, anti-scratch
H01H 2209/018 flat, smooth or ripple-free
H01H 2209/02 UV or light sensitive
H01H 2209/022 Velvet; Mat finish
H01H 2209/024 Properties of the substrate
H01H 2209/046 Properties of the spacer
H01H 2209/068 Properties of the membrane

Top Applicants

Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT

SAMSUNG ELECTRONICS COMPANY KR 37,897
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
APPLIED MATERIALS US 21,640
LG ENERGY SOLUTION KR 20,770
LG CHEM KR 19,835
TOKYO ELECTRON JP 18,519
ROBERT BOSCH DE 14,595
INTEL CORPORATION US 13,580
MURATA MANUFACTURING COMPANY JP 12,151
SAMSUNG SDI COMPANY KR 12,080