CPC Main Group
H01K 3/00 Apparatus or processes adapted to the manufacture, installing, removal, or maintenance of incandescent lamps or parts thereof (manufacture of vessels from glass C03B)
12 direct subcodes
Child Classifications
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- H01K 3/02 Manufacture of incandescent bodies
- H01K 3/06 Attaching of incandescent bodies to mount
- H01K 3/08 Manufacture of mounts or stems
- H01K 3/12 Joining of mount or stem to vessel; Joining parts of the vessel, e.g. by butt sealing
- H01K 3/16 Joining of caps to vessel
- H01K 3/20 Sealing-in wires directly into the envelope
- H01K 3/22 Exhausting, degassing, filling, or cleaning vessels
- H01K 3/26 Closing of vessels
- H01K 3/28 Machines having sequentially arranged operating stations
- H01K 3/30 Repairing or regenerating used or defective lamps
- H01K 3/32 Auxiliary devices for cleaning, placing, or removing incandescent lamps
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080