Apparatus or processes adapted to the manufacture, installing, removal, or maintenance of incandescent lamps or parts thereof (manufacture of vessels from glass C03B)

Filing statistics

CPC H01K 3/00 belongs to the parent subclass H01K, which recorded 1,175 patent applications worldwide between 2013 and 2023. Annual filings declined from 109 in 2013 to 70 in 2023 (-36%), peaking at 144 applications in 2014. The most active applicants in class H01 are SAMSUNG ELECTRONICS COMPANY (37,897 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (36,116 applications) and APPLIED MATERIALS (21,640 applications).

Source: EPO PATSTAT, worldwide filings

12 direct subcodes

Child Classifications

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H01K 3/005
H01K 3/02 Manufacture of incandescent bodies
H01K 3/06 Attaching of incandescent bodies to mount
H01K 3/08 Manufacture of mounts or stems
H01K 3/12 Joining of mount or stem to vessel; Joining parts of the vessel, e.g. by butt sealing
H01K 3/16 Joining of caps to vessel
H01K 3/20 Sealing-in wires directly into the envelope
H01K 3/22 Exhausting, degassing, filling, or cleaning vessels
H01K 3/26 Closing of vessels
H01K 3/28 Machines having sequentially arranged operating stations
H01K 3/30 Repairing or regenerating used or defective lamps
H01K 3/32 Auxiliary devices for cleaning, placing, or removing incandescent lamps

Top Applicants

Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT

SAMSUNG ELECTRONICS COMPANY KR 37,897
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
APPLIED MATERIALS US 21,640
LG ENERGY SOLUTION KR 20,770
LG CHEM KR 19,835
TOKYO ELECTRON JP 18,519
ROBERT BOSCH DE 14,595
INTEL CORPORATION US 13,580
MURATA MANUFACTURING COMPANY JP 12,151
SAMSUNG SDI COMPANY KR 12,080