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CPC Subgroup
H01K 3/12

Joining of mount or stem to vessel; Joining parts of the vessel, e.g. by butt sealing

Full Title

Apparatus or processes adapted to the manufacture, installing, removal, or maintenance of incandescent lamps or parts thereof (manufacture of vessels from glass C03B) > Joining of mount or stem to vessel; Joining parts of the vessel, e.g. by butt sealing

1 direct subcode

Child Classifications

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Top Applicants

Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 37,897
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
  3. APPLIED MATERIALS US 21,640
  4. LG ENERGY SOLUTION KR 20,770
  5. LG CHEM KR 19,835
  6. TOKYO ELECTRON JP 18,519
  7. ROBERT BOSCH DE 14,595
  8. INTEL CORPORATION US 13,580
  9. MURATA MANUFACTURING COMPANY JP 12,151
  10. SAMSUNG SDI COMPANY KR 12,080