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CPC Subgroup
H01R 13/02

Contact members

Full Title

Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 > Contact members

12 direct subcodes

Child Classifications

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  • H01R 13/193 Means for increasing contact pressure at the end of engagement of coupling part
  • H01R 13/26 Pin or blade contacts for sliding co-operation on one side only
  • H01R 13/28 Contacts for sliding cooperation with identically-shaped contact, e.g. for hermaphroditic coupling devices
  • H01R 13/33 Contact members made of resilient wire
  • H01R 13/35 for non-simultaneous co-operation with different types of contact member, e.g. socket co-operating with either round or flat pin

Top Applicants

Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 37,897
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
  3. APPLIED MATERIALS US 21,640
  4. LG ENERGY SOLUTION KR 20,770
  5. LG CHEM KR 19,835
  6. TOKYO ELECTRON JP 18,519
  7. ROBERT BOSCH DE 14,595
  8. INTEL CORPORATION US 13,580
  9. MURATA MANUFACTURING COMPANY JP 12,151
  10. SAMSUNG SDI COMPANY KR 12,080