CPC Main Group
H01R 13/00 Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
15 direct subcodes
Child Classifications
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- H01R 13/02 Contact members
- H01R 13/40 Securing contact members in or to a base or case; Insulating of contact members
- H01R 13/44 Means for preventing access to live contacts
- H01R 13/46 Bases; Cases
- H01R 13/56 Means for preventing chafing or fracture of flexible leads at outlet from coupling part
- H01R 13/58 Means for relieving strain on wire connection, e.g. cord grip
- H01R 13/60 Means for supporting coupling part when not engaged
- H01R 13/62 Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R 13/64 Means for preventing incorrect coupling
- H01R 13/646 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match (non-coaxed protective earth or shield arrangements H01R13/648; coaxed connectors specially adapted for high frequency H01R24/40)
- H01R 13/648 Protective earth or shield arrangements on coupling devices (coaxially arranged shields H01R24/38)
- H01R 13/66 Structural association with built-in electrical component (coupling devices having concentrically or coaxially-arranged contacts H01R24/38)
- H01R 13/72 Means for accommodating flexible lead within the holder
- H01R 13/73 Means for mounting coupling parts to apparatus or structures, e.g. to a wall
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080