CPC Main Group
H01R 13/00 Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
Filing statistics
CPC H01R 13/00 belongs to the parent subclass H01R, which recorded 238,918 patent applications worldwide between 2013 and 2023. Annual filings grew from 16,339 in 2013 to 20,728 in 2023 (+27%), peaking at 26,812 applications in 2017. The most active applicants in class H01 are SAMSUNG ELECTRONICS COMPANY (37,897 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (36,116 applications) and APPLIED MATERIALS (21,640 applications).
Source: EPO PATSTAT, worldwide filings
15 direct subcodes
Child Classifications
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- H01R 13/02 Contact members
- H01R 13/40 Securing contact members in or to a base or case; Insulating of contact members
- H01R 13/44 Means for preventing access to live contacts
- H01R 13/46 Bases; Cases
- H01R 13/56 Means for preventing chafing or fracture of flexible leads at outlet from coupling part
- H01R 13/58 Means for relieving strain on wire connection, e.g. cord grip
- H01R 13/60 Means for supporting coupling part when not engaged
- H01R 13/62 Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R 13/64 Means for preventing incorrect coupling
- H01R 13/646 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match (non-coaxed protective earth or shield arrangements H01R13/648; coaxed connectors specially adapted for high frequency H01R24/40)
- H01R 13/648 Protective earth or shield arrangements on coupling devices (coaxially arranged shields H01R24/38)
- H01R 13/66 Structural association with built-in electrical component (coupling devices having concentrically or coaxially-arranged contacts H01R24/38)
- H01R 13/72 Means for accommodating flexible lead within the holder
- H01R 13/73 Means for mounting coupling parts to apparatus or structures, e.g. to a wall
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080