CPC Subgroup
H01R 13/6584 formed by conductive elastomeric members, e.g. flat gaskets or O-rings
Full Title
Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 > Protective earth or shield arrangements on coupling devices (coaxially arranged shields H01R24/38) > High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse] > Shield structure > with resilient means for engaging mating connector > with separate conductive resilient members between mating shield members > formed by conductive elastomeric members, e.g. flat gaskets or O-rings
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080