Means for mounting coupling parts to apparatus or structures, e.g. to a wall

Full Title

Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 > Means for mounting coupling parts to apparatus or structures, e.g. to a wall

1 direct subcode

Child Classifications

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H01R 13/74 Means for mounting coupling parts in openings of a panel

Top Applicants

Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT

SAMSUNG ELECTRONICS COMPANY KR 37,897
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
APPLIED MATERIALS US 21,640
LG ENERGY SOLUTION KR 20,770
LG CHEM KR 19,835
TOKYO ELECTRON JP 18,519
ROBERT BOSCH DE 14,595
INTEL CORPORATION US 13,580
MURATA MANUFACTURING COMPANY JP 12,151
SAMSUNG SDI COMPANY KR 12,080