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CPC Subgroup
H01R 24/60

Contacts spaced along planar side wall transverse to longitudinal axis of engagement

Full Title

Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure (contact members H01R13/02; securing contact members in or to a base or case or insulating of contact members H01R13/40; bases or cases H01R13/46; means for supporting coupling part when not engaged H01R13/60; means for facilitating engagement or disengagement of coupling parts or for holding them in engagement H01R13/62; means for preventing, inhibiting or avoiding incorrect coupling H01R13/64) > Contacts spaced along planar side wall transverse to longitudinal axis of engagement

Filing statistics

CPC H01R 24/60 belongs to the parent subclass H01R, which recorded 238,918 patent applications worldwide between 2013 and 2023. Annual filings grew from 16,339 in 2013 to 20,728 in 2023 (+27%), peaking at 26,812 applications in 2017. The most active applicants in class H01 are SAMSUNG ELECTRONICS COMPANY (37,897 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (36,116 applications) and APPLIED MATERIALS (21,640 applications).

Source: EPO PATSTAT, worldwide filings

1 direct subcode

Child Classifications

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Top Applicants

Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 37,897
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
  3. APPLIED MATERIALS US 21,640
  4. LG ENERGY SOLUTION KR 20,770
  5. LG CHEM KR 19,835
  6. TOKYO ELECTRON JP 18,519
  7. ROBERT BOSCH DE 14,595
  8. INTEL CORPORATION US 13,580
  9. MURATA MANUFACTURING COMPANY JP 12,151
  10. SAMSUNG SDI COMPANY KR 12,080