CPC Main Group
H01R 24/00 Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure (contact members H01R13/02; securing contact members in or to a base or case or insulating of contact members H01R13/40; bases or cases H01R13/46; means for supporting coupling part when not engaged H01R13/60; means for facilitating engagement or disengagement of coupling parts or for holding them in engagement H01R13/62; means for preventing, inhibiting or avoiding incorrect coupling H01R13/64)
10 direct subcodes
Child Classifications
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- H01R 24/20 Coupling parts carrying sockets, clips or analogous contacts and secured only to wire or cable
- H01R 24/28 Coupling parts carrying pins, blades or analogous contacts and secured only to wire or cable
- H01R 24/38 having concentrically or coaxially arranged contacts
- H01R 24/58 Contacts spaced along longitudinal axis of engagement
- H01R 24/60 Contacts spaced along planar side wall transverse to longitudinal axis of engagement
- H01R 24/66 with pins, blades or analogous contacts and secured to apparatus or structure, e.g. to a wall
- H01R 24/76 with sockets, clips or analogous contacts and secured to apparatus or structure, e.g. to a wall
- H01R 24/84 Hermaphroditic coupling devices
- H01R 24/86 Parallel contacts arranged about a common axis
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080