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CPC Main Group
H01R 27/00

Coupling parts adapted for co-operation with two or more dissimilar counterparts (; supported only by co-operation with a counterpart H01R31/00; with a holder adapted for supporting apparatus to which its counterpart is attached H01R33/90)

Filing statistics

CPC H01R 27/00 belongs to the parent subclass H01R, which recorded 238,918 patent applications worldwide between 2013 and 2023. Annual filings grew from 16,339 in 2013 to 20,728 in 2023 (+27%), peaking at 26,812 applications in 2017. The most active applicants in class H01 are SAMSUNG ELECTRONICS COMPANY (37,897 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (36,116 applications) and APPLIED MATERIALS (21,640 applications).

Source: EPO PATSTAT, worldwide filings

1 direct subcode

Child Classifications

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  • H01R 27/02 for simultaneous co-operation with two or more counterparts

Top Applicants

Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 37,897
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
  3. APPLIED MATERIALS US 21,640
  4. LG ENERGY SOLUTION KR 20,770
  5. LG CHEM KR 19,835
  6. TOKYO ELECTRON JP 18,519
  7. ROBERT BOSCH DE 14,595
  8. INTEL CORPORATION US 13,580
  9. MURATA MANUFACTURING COMPANY JP 12,151
  10. SAMSUNG SDI COMPANY KR 12,080