CPC Main Group
H01R 25/00 Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits (supported only by co-operation with a counterpart H01R31/00; with a holder adapted for supporting apparatus to which its counterpart is attached H01R33/88)
Filing statistics
CPC H01R 25/00 belongs to the parent subclass H01R, which recorded 238,918 patent applications worldwide between 2013 and 2023. Annual filings grew from 16,339 in 2013 to 20,728 in 2023 (+27%), peaking at 26,812 applications in 2017. The most active applicants in class H01 are SAMSUNG ELECTRONICS COMPANY (37,897 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (36,116 applications) and APPLIED MATERIALS (21,640 applications).
Source: EPO PATSTAT, worldwide filings
4 direct subcodes
Child Classifications
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- H01R 25/14 Rails or bus-bars constructed so that the counterparts can be connected thereto at any point along their length (supporting elements for lighting devices, displaceable along guiding elements and making electrical contact with conductors running along the guiding elements F21V21/35)
- H01R 25/16 Rails or bus-bars provided with a plurality of discrete connecting locations for counterparts
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080