CPC Subgroup
H04N 23/50 Constructional details
Full Title
Cameras or camera modules comprising electronic image sensors; Control thereof > Constructional details
6 direct subcodes
Child Classifications
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- H04N 23/51 Housings
- H04N 23/52 Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
- H04N 23/53 of electronic viewfinders, e.g. rotatable or detachable
- H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
- H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
Top Applicants
Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT
- HUAWEI TECHNOLOGIES COMPANY CN 101,476
- QUALCOMM US 101,139
- SAMSUNG ELECTRONICS COMPANY KR 96,655
- TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 57,744
- LG ELECTRONICS KR 55,253
- HUAWEI TECHNOLOGIES COMPANY 54,181
- SONY CORPORATION JP 35,309
- ZTE CORPORATION CN 32,950
- INTEL CORPORATION US 27,533
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION CN 27,498