CPC Subgroup Additional Only
H04R 2201/02 Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups
Full Title
Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups > Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups
5 direct subcodes
Child Classifications
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- H04R 2201/021 Transducers or their casings adapted for mounting in or to a wall or ceiling
- H04R 2201/023 Transducers incorporated in garment, rucksacks or the like
- H04R 2201/025 Transducer mountings or cabinet supports enabling variable orientation of transducer of cabinet
- H04R 2201/028 Structural combinations of loudspeakers with built-in power amplifiers, e.g. in the same acoustic enclosure (H04R2499/10 takes precedence; Single (sub)woofer with two or more satellite loudspeakers for mid- and high-frequency band reproduction driven via the (sub)woofer H04R2205/026)
- H04R 2201/029 Manufacturing aspects of enclosures transducers
Top Applicants
Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT
- HUAWEI TECHNOLOGIES COMPANY CN 101,476
- QUALCOMM US 101,139
- SAMSUNG ELECTRONICS COMPANY KR 96,655
- TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 57,744
- LG ELECTRONICS KR 55,253
- HUAWEI TECHNOLOGIES COMPANY 54,181
- SONY CORPORATION JP 35,309
- ZTE CORPORATION CN 32,950
- INTEL CORPORATION US 27,533
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION CN 27,498