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CPC Subgroup Additional Only
H04R 2201/02

Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups

Full Title

Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups > Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups

5 direct subcodes

Child Classifications

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  • H04R 2201/021 Transducers or their casings adapted for mounting in or to a wall or ceiling
  • H04R 2201/023 Transducers incorporated in garment, rucksacks or the like
  • H04R 2201/025 Transducer mountings or cabinet supports enabling variable orientation of transducer of cabinet
  • H04R 2201/028 Structural combinations of loudspeakers with built-in power amplifiers, e.g. in the same acoustic enclosure (H04R2499/10 takes precedence; Single (sub)woofer with two or more satellite loudspeakers for mid- and high-frequency band reproduction driven via the (sub)woofer H04R2205/026)
  • H04R 2201/029 Manufacturing aspects of enclosures transducers

Top Applicants

Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT

  1. HUAWEI TECHNOLOGIES COMPANY CN 101,476
  2. QUALCOMM US 101,139
  3. SAMSUNG ELECTRONICS COMPANY KR 96,655
  4. TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 57,744
  5. LG ELECTRONICS KR 55,253
  6. HUAWEI TECHNOLOGIES COMPANY 54,181
  7. SONY CORPORATION JP 35,309
  8. ZTE CORPORATION CN 32,950
  9. INTEL CORPORATION US 27,533
  10. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION CN 27,498