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CPC Subgroup Additional Only
H04R 2201/10

Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups

Full Title

Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups > Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups

4 direct subcodes

Child Classifications

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  • H04R 2201/103 Combination of monophonic or stereophonic headphones with audio players, e.g. integrated in the headphone
  • H04R 2201/105 Manufacture of mono- or stereophonic headphone components
  • H04R 2201/107 Monophonic and stereophonic headphones with microphone for two-way hands free communication
  • H04R 2201/109 Arrangements to adapt hands free headphones for use on both ears

Top Applicants

Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT

  1. HUAWEI TECHNOLOGIES COMPANY CN 101,476
  2. QUALCOMM US 101,139
  3. SAMSUNG ELECTRONICS COMPANY KR 96,655
  4. TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 57,744
  5. LG ELECTRONICS KR 55,253
  6. HUAWEI TECHNOLOGIES COMPANY 54,181
  7. SONY CORPORATION JP 35,309
  8. ZTE CORPORATION CN 32,950
  9. INTEL CORPORATION US 27,533
  10. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION CN 27,498