CPC Main Group Additional Only
H04R 2307/00 Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
Filing statistics
CPC H04R 2307/00 belongs to the parent subclass H04R, which recorded 161,989 patent applications worldwide between 2013 and 2023. Annual filings grew from 9,314 in 2013 to 13,794 in 2023 (+48%), peaking at 18,978 applications in 2020. The most active applicants in class H04 are HUAWEI TECHNOLOGIES COMPANY (101,476 applications), QUALCOMM (101,139 applications) and SAMSUNG ELECTRONICS COMPANY (96,655 applications).
Source: EPO PATSTAT, worldwide filings
8 direct subcodes
Child Classifications
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- H04R 2307/021 Diaphragms comprising cellulose-like materials, e.g. wood, paper, linen
- H04R 2307/023 Diaphragms comprising ceramic-like materials, e.g. pure ceramic, glass, boride, nitride, carbide, mica and carbon materials
- H04R 2307/025 Diaphragms comprising polymeric materials
- H04R 2307/027 Diaphragms comprising metallic materials
- H04R 2307/029 Diaphragms comprising fibres
- H04R 2307/201 Damping aspects of the outer suspension of loudspeaker diaphragms by addition of additional damping means
- H04R 2307/204 Material aspects of the outer suspension of loudspeaker diaphragms
- H04R 2307/207 Shape aspects of the outer suspension of loudspeaker diaphragms
Top Applicants
Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT
- HUAWEI TECHNOLOGIES COMPANY CN 101,476
- QUALCOMM US 101,139
- SAMSUNG ELECTRONICS COMPANY KR 96,655
- TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 57,744
- LG ELECTRONICS KR 55,253
- HUAWEI TECHNOLOGIES COMPANY 54,181
- SONY CORPORATION JP 35,309
- ZTE CORPORATION CN 32,950
- INTEL CORPORATION US 27,533
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION CN 27,498