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CPC Main Group Additional Only
H04R 2307/00

Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups

8 direct subcodes

Child Classifications

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  • H04R 2307/021 Diaphragms comprising cellulose-like materials, e.g. wood, paper, linen
  • H04R 2307/023 Diaphragms comprising ceramic-like materials, e.g. pure ceramic, glass, boride, nitride, carbide, mica and carbon materials
  • H04R 2307/025 Diaphragms comprising polymeric materials
  • H04R 2307/027 Diaphragms comprising metallic materials
  • H04R 2307/029 Diaphragms comprising fibres
  • H04R 2307/201 Damping aspects of the outer suspension of loudspeaker diaphragms by addition of additional damping means
  • H04R 2307/204 Material aspects of the outer suspension of loudspeaker diaphragms
  • H04R 2307/207 Shape aspects of the outer suspension of loudspeaker diaphragms

Top Applicants

Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT

  1. HUAWEI TECHNOLOGIES COMPANY CN 101,476
  2. QUALCOMM US 101,139
  3. SAMSUNG ELECTRONICS COMPANY KR 96,655
  4. TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 57,744
  5. LG ELECTRONICS KR 55,253
  6. HUAWEI TECHNOLOGIES COMPANY 54,181
  7. SONY CORPORATION JP 35,309
  8. ZTE CORPORATION CN 32,950
  9. INTEL CORPORATION US 27,533
  10. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION CN 27,498