CPC Subgroup Additional Only
H04R 2307/029 Diaphragms comprising fibres
Full Title
Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups > Diaphragms comprising fibres
Top Applicants
Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT
- HUAWEI TECHNOLOGIES COMPANY CN 101,476
- QUALCOMM US 101,139
- SAMSUNG ELECTRONICS COMPANY KR 96,655
- TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 57,744
- LG ELECTRONICS KR 55,253
- HUAWEI TECHNOLOGIES COMPANY 54,181
- SONY CORPORATION JP 35,309
- ZTE CORPORATION CN 32,950
- INTEL CORPORATION US 27,533
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION CN 27,498