CPC Subgroup
H04W 12/40 Security arrangements using identity modules
Full Title
Security arrangements; Authentication; Protecting privacy or anonymity > Security arrangements using identity modules
5 direct subcodes
Child Classifications
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- H04W 12/42 using virtual identity modules
- H04W 12/43 using shared identity modules, e.g. SIM sharing
- H04W 12/45 using multiple identity modules
- H04W 12/47 using near field communication [NFC] or radio frequency identification [RFID] modules
- H04W 12/48 using secure binding, e.g. securely binding identity modules to devices, services or applications
Top Applicants
Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT
- HUAWEI TECHNOLOGIES COMPANY CN 101,476
- QUALCOMM US 101,139
- SAMSUNG ELECTRONICS COMPANY KR 96,655
- TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 57,744
- LG ELECTRONICS KR 55,253
- HUAWEI TECHNOLOGIES COMPANY 54,181
- SONY CORPORATION JP 35,309
- ZTE CORPORATION CN 32,950
- INTEL CORPORATION US 27,533
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION CN 27,498