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IPC Subgroup
H04W 12/4

Security arrangements using identity modules

Introduced: January 2021

Full Title

Security arrangements; Authentication; Protecting privacy or anonymity > Security arrangements using identity modules

Classification Context

Section:
ELECTRICITY
Class:
ELECTRIC COMMUNICATION TECHNIQUE
Subclass:
WIRELESS COMMUNICATION NETWORKS

5 direct subcodes

Child Classifications

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  • H04W 12/42 using virtual identity modules
  • H04W 12/43 using shared identity modules, e.g. SIM sharing
  • H04W 12/45 using multiple identity modules
  • H04W 12/47 using near field communication [NFC] or radio frequency identification [RFID] modules
  • H04W 12/48 using secure binding, e.g. securely binding identity modules to devices, services or applications

Top Applicants

Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT

  1. QUALCOMM US 97,396
  2. HUAWEI TECHNOLOGIES COMPANY CN 96,502
  3. SAMSUNG ELECTRONICS COMPANY KR 86,981
  4. TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 55,869
  5. HUAWEI TECHNOLOGIES COMPANY 55,349
  6. LG ELECTRONICS KR 53,649
  7. CANON 33,341
  8. SONY CORPORATION JP 32,761
  9. ZTE CORPORATION CN 32,274
  10. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 28,327