IPC Subgroup
H04W 12/4 Security arrangements using identity modules
Introduced: January 2021
Full Title
Security arrangements; Authentication; Protecting privacy or anonymity > Security arrangements using identity modules
Classification Context
- Section:
- ELECTRICITY
- Class:
- ELECTRIC COMMUNICATION TECHNIQUE
- Subclass:
- WIRELESS COMMUNICATION NETWORKS
5 direct subcodes
Child Classifications
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- H04W 12/42 using virtual identity modules
- H04W 12/43 using shared identity modules, e.g. SIM sharing
- H04W 12/45 using multiple identity modules
- H04W 12/47 using near field communication [NFC] or radio frequency identification [RFID] modules
- H04W 12/48 using secure binding, e.g. securely binding identity modules to devices, services or applications
Top Applicants
Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT
- QUALCOMM US 97,396
- HUAWEI TECHNOLOGIES COMPANY CN 96,502
- SAMSUNG ELECTRONICS COMPANY KR 86,981
- TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 55,869
- HUAWEI TECHNOLOGIES COMPANY 55,349
- LG ELECTRONICS KR 53,649
- CANON 33,341
- SONY CORPORATION JP 32,761
- ZTE CORPORATION CN 32,274
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 28,327